Post date: January 30, 2010 |   Print |   Email

The changing global security landscape calls for the U.S. Department of Defense and its suppliers to respond in innovative ways to successfully carry out challenging mission responsibilities

What does this mean for the global electronics base?  Jeff Wilcox, vice president for engineering, Lockheed Martin, will provide insight for IPC APEX EXPO attendees in his keynote address, “Achieving Strategic Balance: Integrating Global Security Solutions in the New Operational Landscape,” Tuesday, April 6, 2010, in Las Vegas.

Responsible for developing and executing strategy for the Lockheed Martin Engineering Enterprise and its 71,000 engineers and scientists, Wilcox will discuss how the company is meeting the challenges of developing a full spectrum of global security solutions and the implications that defense “re-prioritization” of goals and objectives has for the global electronics base.

“The global security solutions we are developing today are being architected to provide unprecedented flexibility for addressing customer needs that will evolve over decades to come in ways that are difficult to predict today,” says Wilcox.

In his role with Lockheed Martin, Wilcox collaborates with business area leadership to ensure the right people, processes, tools and technology are in place to successfully deliver solutions to customers’ most complex challenges. He adds, “Designing greater degrees of flexibility into our system solutions requires a new partnership with the global supplier base, one focused on high levels of transparency, reliability, performance and scalability.”

Providing valuable insight for IPC APEX EXPO attendees, Wilcox will share information on Lockheed Martin systems in development that meet the military’s challenges of rapid capability deployment, affordability and achieving strategic balance.

A native of LeRoy, N.Y., Wilcox holds a master’s degree in electrical engineering from Drexel University, Philadelphia, Pa., and is a graduate of Case Western Reserve University, Cleveland, Ohio, with a degree in biomedical engineering.

For more information on IPC APEX EXPO activities, visit www.IPCAPEXEXPO.org.

Source: IPC

Permalink: http://www.pcbtalk.com/news-detail.php?newsID=354