Post date: February 02, 2010 |   Print |   Email

Printed Circuits offers their customers the ability to bury resistors and capacitors in their rigid flex and flexible circuits, improving electrical performance, freeing up board space for additional processing capability, allowing greater electronic miniaturization and improved reliability

Modern electronic designs can be increasingly constrained by the number of passive components that are required. Current designs feature high density processors with a dramatic growth in the number of passive components needed to support them.

Materials are readily available that allow circuit manufacturers to "bury" resistors and capacitors within the circuit board – giving circuit designers improved circuit density, device miniaturization, greater reliability, higher assembly yields, simplified in-circuit testing, improved signal processing and the minimizing of signal integrity issues.

Another feature is that the passive devices can be located near the processor chip, improving electrical performance and minimizing parasitic interference caused by remote location, vias, traces, etc.

"Rigid flex, and flex in general, is a natural path to device miniaturization" said Ken Tannehill President of Printed Circuits, Inc. "We notice that as boards get more complicated, they actually get smaller and thinner. Flexible circuits allow our customers' designers the freedom to use the form to provide the function, rather than the other way around. With buried passives, we are helping our customers achieve the next level of reliability, density and simplicity in their designs."

For further information please visit www.PrintedCircuits.com.

Source: Printed Circuits, Incorporated

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